Toshiba Bluetooth IC With Integrated DSP Targets Automotive Audio Streaming And Hands-Free Subsystems

Built-in supporting circuitry and inclusion of full software stack and profiles saves on system bill-of-materials costs and helps lower time to market

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new system IC that combines full Bluetooth® operation with audio processing capabilities and supporting circuitry. The TC35668IXBG offers a highly integrated solution for automotive hands-free and audio streaming subsystems. Suitable for integration by car OEMs and for after-sales automotive market audio systems, the new IC can also form the basis of a subsystem such as a wireless speaker.

Deepak Mithani, senior director, Mixed-Signal Business Unit, System LSI Group at TAEC, noted, “Consumer demand for the latest automotive technologies continues to grow, hand-in-hand with the need to make these capabilities as safe as possible. This new IC allows developers to build hands-free functionality at the system level, harnessing the power of Toshiba’s proven ARM® processor-based cores together with our expertise in Bluetooth-enabled technology.”

The TC35668IXBG features three core elements: an ARM Cortex®-M3 based system core; a Bluetooth core with 52MHz ARM7TDMI-S®; and a 208MHz CEVA TeakLite-III® DSP core. The Bluetooth core combines a transceiver, antenna switch, balun, low noise amplifier and power amplifier. Toshiba has integrated not only the standard Bluetooth HCI (host controller interface) hardware and software but also a full software stack and a set of 14 classic and BLE GATT profiles, which are Bluetooth SIG compliant. Stack and profiles are pre-certified and reside in ROM, and application code is stored in an external serial flash memory and executed from internal SRAM. This combination of hardware and software results in a very small bill of materials that can help companies minimize system size and cost, and allows a faster time-to-market due to proven embedded software.

In addition to full support for Bluetooth v4.0 with embedded stack, various Bluetooth Classic profiles and Bluetooth Low Energy (BLE) GATT profile, Toshiba has incorporated a DSP that allows for acoustic improvements inside a noisy environment, such as a car, and echo cancellation for hands-free systems. The signal processor is also capable of decoding audio content, including MP3 and AAC files. Another embedded MCU enables the execution of application software.

The TC35668IXBG is supplied in a compact 97-ball P-VFBGA package measuring 6.0 x 6.0 x 1.0mm. A trace UART interface is incorporated that aids system debugging and enables developers to tune the characteristics of the device for echo cancellation and noise reduction.

Availability

Sampling now, the TC35668IXBG is slated to begin mass production in Q3 2015.

The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.; Toshiba uses them under license.

ARM and Cortex are trademarks or registered trademarks of ARM Limited in the EU and other countries.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor manufacturer and the world’s sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide.

© 2015 Toshiba America Electronic Components, Inc. All rights reserved.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

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